Shenzhen Huayi Brother Technology Co., Ltd

 Semiconductor wafer cutting fluid TUW-1295

Product Introduction

This product is suitable for the cutting and cleaning of semiconductor wafers and optoelectronic materials, focusing on reducing electrostatic accumulation and sawdust particle pollution in the manufacturing process. It has good dirt dispersion ability and anti-static ability, and the particles after cutting will not adhere to the product. The lubrication and cleaning effect is excellent, and there is no corrosion to the workpiece, making it green and environmentally friendly.

Product parameters

Usage method

 1. The product is equipped with a dedicated liquid supply system for infusion into the cutting machine.

2. If the foam is too large when cutting the wafer, please adjust the transmission frequency of the liquid supply system.

Note

This product is an industrial chemical. If it accidentally splashes into the eyes, immediately rinse it with clean water. If you feel unwell, seek medical attention

Storage and Packaging 

1. Store in a sealed and cool environment at around 25 ℃.

2. Packaging specification: 1 gallon/barrel or 25kg/barrel.

3. Shelf life: 12 months.

  Disclaimer

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The above information has been strictly tested by our company's technical personnel, and the provided data is cautious and reliable. However, it is not equivalent to the product achieving the same effect under any environmental conditions. Customers should determine the specific usage method based on their own environment and operational situation after actual trial use. If there is any impact or loss caused by improper customer operation, our company will not bear any responsibility.

Environmental policy

TUW will acknowledge and exercise the following responsibilities:

Eliminate the possibility of pollution from the source anytime, anywhere

Developing products with minimal environmental impact